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Vertically integrated optoelectronics package for MEMS devices
United States Patent
10,139,564 | |
November 27, 2018 | |
View the Complete Patent at the US Patent & Trademark Office | |
The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein. | |
15/ 009,153 | |
January 28, 2016 | |
1/1 | |
G02B 6/122 (20060101)H01S 5/42 (20060101)H01S 5/343 (20060101)G02B 6/42 (20060101)H01S 5/022 (20060101)G02B 6/34 (20060101) | |
STATEMENT OF GOVERNMENT INTEREST This application was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the application. |