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Vertically integrated optoelectronics package for MEMS devices

United States Patent

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November 27, 2018
View the Complete Patent at the US Patent & Trademark Office
The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.
15/ 009,153
January 28, 2016
G02B 6/122 (20060101)H01S 5/42 (20060101)H01S 5/343 (20060101)G02B 6/42 (20060101)H01S 5/022 (20060101)G02B 6/34 (20060101)
STATEMENT OF GOVERNMENT INTEREST This application was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the application.