To address the current national emergency, U.S. entities may be eligible to license select Sandia intellectual property at no cost for a limited time. Learn more.

Search/Browse Tech

Vertically integrated optoelectronics package for MEMS devices

United States Patent

To discuss licensing opportunities, fill out our Contact Form 
November 27, 2018
View the Complete Patent at the US Patent & Trademark Office
The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.
January 28, 2016
G02B 6/122 (20060101); H01S 5/42 (20060101); H01S 5/343 (20060101); G02B 6/42 (20060101); H01S 5/022 (20060101); G02B 6/34 (20060101);
STATEMENT OF GOVERNMENT INTEREST This application was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the application.