Electroplated AU for conformal coating of high aspect ratio silicon structures

Patent Number:	10,147,510
Issued:	December 4, 2018
Official Filing:	View the Complete Patent at the US Patent & Trademark Office
Technology:	Large Field of View, 3D X-ray Phase Contrast Imaging System
Abstract:	A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Application Number:	14/081,342
Filed:	November 15, 2013
Current U.S. Class:	1/1;
Current International Class:	C25D 3/48 (20060101); G21K 1/10 (20060101);
Field of Search:
Government Interests:	GOVERNMENT RIGHTS This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.