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Heating and cooling devices, systems and related method

United States Patent

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August 7, 2018
View the Complete Patent at the US Patent & Trademark Office
Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.
14/ 487,540
September 16, 2014
F25B 1/00 (20060101)F25B 41/04 (20060101)F25B 3/00 (20060101)
STATEMENT REGARDING GOVERNMENT RESEARCH AND DEVELOPMENT This invention was made with Government support under government contract no. DE-AC04-94AL85000 awarded by U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention, including a paid-up license and the right, in limited circumstances, to require the owner of any patent issuing in this invention to license others on reasonable terms.