To address the current national emergency, U.S. entities may be eligible to license select Sandia intellectual property at no cost for a limited time. Learn more.

Search/Browse Tech

Flexible packaging for microelectronic devices

United States Patent

To discuss licensing opportunities, fill out our Contact Form 
9,978,895
May 22, 2018
View the Complete Patent at the US Patent & Trademark Office
An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.
14/068,189
October 31, 2013
1/1;
H01L 31/0203 (20140101); H01L 31/048 (20140101); H01L 31/18 (20060101); H01L 31/049 (20140101);
GOVERNMENT RIGHTS This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.