| Abstract: | An apparatus, method, and system, the apparatus and system including a
flexible microsystems enabled microelectronic device package including a
microelectronic device positioned on a substrate; an encapsulation layer
encapsulating the microelectronic device and the substrate; a protective
layer positioned around the encapsulating layer; and a reinforcing layer
coupled to the protective layer, wherein the substrate, encapsulation
layer, protective layer and reinforcing layer form a flexible and
optically transparent package around the microelectronic device. The
method including encapsulating a microelectronic device positioned on a
substrate within an encapsulation layer; sealing the encapsulated
microelectronic device within a protective layer; and coupling the
protective layer to a reinforcing layer, wherein the substrate,
encapsulation layer, protective layer and reinforcing layer form a
flexible and optically transparent package around the microelectronic
device. |