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Packaging system with cleaning channel and method of making the same

United States Patent

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May 15, 2018
View the Complete Patent at the US Patent & Trademark Office
A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of the surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.
15/ 388,210
December 22, 2016
H01L 23/31 (20060101)H01L 21/50 (20060101)H01L 23/498 (20060101)H01L 23/057 (20060101)H01L 25/065 (20060101)
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.