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Lateral vias for connections to buried microconductors

United States Patent

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9,972,565
May 15, 2018
View the Complete Patent at the US Patent & Trademark Office
The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
15/175,312
June 7, 2016
1/1;
H01L 23/538 (20060101); H01L 23/498 (20060101); H01L 21/48 (20060101); H01L 23/00 (20060101); H01L 23/31 (20060101);
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.