Apparatus for assembly of microelectronic devices

Patent Number: 9,763,370
Issued: 9/12/2017
Official Filing: View the Complete Patent
Abstract: An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.
Filed: 11/25/2013
Application Number: 14/88,725
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.