Fast process flow, on-wafer interconnection and singulation for MEPV

United States Patent

9,748,415
August 29, 2017
View the Complete Patent at the US Patent & Trademark Office
Microsystems Enabled Photovoltaics (MEPV)
A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.
15/360,553
November 23, 2016
1/1;
H01L 31/02 (20060101); H01L 31/061 (20120101); H01L 31/18 (20060101);
STATEMENT OF GOVERNMENT RIGHTS This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.