Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages

Patent Number:	9,653,230
Issued:	May 16, 2017
Official Filing:	View the Complete Patent at the US Patent & Trademark Office
Technology:	Push Plate for Ball Grid Array Test Sockets
Abstract:	A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.
Application Number:	13/767,578
Filed:	February 14, 2013
Current U.S. Class:	1/1;
Current International Class:	H01R 13/62 (20060101); H01H 13/50 (20060101); H05K 3/30 (20060101); H01R 13/639 (20060101);
Field of Search:	;200/534 ;439/8,66,331,73 ;73/827,842
Government Interests:	STATEMENT OF GOVERNMENT INTEREST The United States Government has rights in this invention pursuant to Contract No. DE-AC04-94AL85000 between the United States Department of Energy and Sandia Corporation, for the operation of the Sandia National Laboratories.