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Device-packaging method and apparatus for optoelectronic circuits

United States Patent

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April 25, 2017
View the Complete Patent at the US Patent & Trademark Office
An optoelectronic device package and a method for its fabrication are provided. The device package includes a lid die and an active die that is sealed or sealable to the lid die and in which one or more optical waveguides are integrally defined. The active die includes one or more active device regions, i.e. integral optoelectronic devices or etched cavities for placement of discrete optoelectronic devices. Optical waveguides terminate at active device regions so that they can be coupled to them. Slots are defined in peripheral parts of the active dies. At least some of the slots are aligned with the ends of integral optical waveguides so that optical fibers or optoelectronic devices inserted in the slots can optically couple to the waveguides.
14/ 819,293
August 5, 2015
G02B 6/42 (20060101)G02B 6/122 (20060101)
STATEMENT OF GOVERNMENT INTEREST This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.