Low-temperature nanosolders

United States Patent

October 11, 2016
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Self-protected, Low-temperature Nanosolder
A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell "glued" around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150.degree. C.
October 5, 2015
B23K 35/02 (20060101); B32B 15/01 (20060101); B23K 35/30 (20060101); B23K 35/365 (20060101); B23K 35/40 (20060101);
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U. S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.