Structured wafer for device processing

United States Patent

May 20, 2014
View the Complete Patent at the US Patent & Trademark Office
Microsystems Enabled Photovoltaics (MEPV)
A structured wafer that includes through passages is used for device processing. Each of the through passages extends from or along one surface of the structured wafer and forms a pattern on a top surface area of the structured wafer. The top surface of the structured wafer is bonded to a device layer via a release layer. Devices are processed on the device layer, and are released from the structured wafer using etchant. The through passages within the structured wafer allow the etchant to access the release layer to thereby remove the release layer.
September 21, 2011
257/618 ; 257/E21.499; 438/113;
H01L 29/06 (20060101);
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FEDERALLY SPONSORED RESEARCH The United States Government has rights in this invention pursuant to Department of Energy Contract No. DE-AC04-94AL85000 with Sandia Corporation.